This conductive paste is formulated by low melting point metal powder and high melting point metal powder with resin, subsequently curing the resin through heating.

This series of products have good printability and conductive properties, can replace silver paste applied on ceramic substrate and glass substrate, play a important role in reducing cost.

This series of products have good printability. The silver layer has excellent conductivity and good quality reliability after high-temperature sintering. It does not contain Pb, Cd and other harmful elements (In accordance with RoHS 2.0 requirements).

It is used in the series of microwave dielectric resonators and other environmental protection products.

Silver-Palladium Paste is applied to the internal electrode printing of MLCC products.

Electronic paste for copper electrode of varistor HS-C01 is a copper paste suitable for ZnO varistorelectrode.

STST-101 is a low-temperature curing silver slurry product designed for application to the external electrodes of MLCCs (0402 size and larger) with soft terminals. This product features a complete and flawless slurry adhesion morphology, with the soft terminal electrodes adhering firmly to the end electrodes, making them difficult to detach. It also exhibits excellent electrical conductivity, strong bending resistance, and high reliability.

HS-S01T series is a fine line silver aluminum paste applied to the front of topcon. It has the same excellent printing performance as perc sterling silver paste and excellent long-term printability. It is suitable for wide sintering window, and has excellent contact performance on the batteries coated with different equipment processes, which meets the requirements of DH1000 components.

The HS980TL series is a fine-line silver paste used in Topcon batteries for laser-assisted sintering processes (Leco). It is suitable for narrow line width printing conditions, has good printing plasticity, high open circuit voltage, good contact performance, high conversion efficiency, excellent module reliability, and shows good performance with customer cells of different front sheet resistances.

The HS-S90TPL series is a rear silver paste used in Topcon batteries. It performs well on mesh plates with different line widths, has good print line shape and long-term printing performance, good adhesion after drying, low moisture content, high conversion efficiency, meeting the requirements for cost reduction and efficiency enhancement for customers.

HS701-A is a pure silver fine grid paste designed for use in heterojunction solar cells. It exhibits excellent electrical conductivity and good contact with the TCO film, thus achieving a lower wet weight at equal conversion efficiency. The product also offers stable printing performance, and is compatible with printing speeds of 300-500mm/s, enabling it to meet the diverse printing process requirements of different users.

HS550-AZ and HS460-AB are silver-coated copper fine grid pastes designed for the front and back of heterojunction solar cells, respectively. They provide excellent printing performance and fine grid lines with a high aspect ratio. The modules manufactured using these two pastes exhibit reliable performance. With a respective silver content of 50% and 40%, these pastes can effectively meet customers' cost reduction requirements.